JOIN Our team

Are you passionate about pushing the boundaries of technology? Join our pioneering Research & Development team, where we specialize in silicon interconnect IP solutions for advanced die-to-die connectivity, chiplet ecosystems, and cutting-edge packaging technologies. We're on a mission to drive innovation in semiconductor integration, enabling next-generation performance for high-performance computing, AI, and data-centric applications. 

 We're seeking talented and energetic individuals who thrive on solving complex challenges, designing high-speed interconnects in 

• Analog/Mixed-Signal Design 
• Layout/Physical Design 
• Digital/RTL Design, Verification & Firmware Design
• Signal Integrity & Package Design